منابع مشابه
Bump Mapping
Blinn [1] introduced bump mapping as a technique that makes a surface appear rough or wrinkled. This affect is achieved by perturbing the normals used in the illumination computation. Hence, it only affects the shading, not the underlying geometry. The bump map can contain height values that will affect the normal of each pixel. However, it can as an alternative contain normals that have been c...
متن کاملSmoothing of Bump Functions
Let X be a separable Banach space with a Schauder basis, admitting a continuous bump which depends locally on finitely many coordinates. Then X admits also a C∞-smooth bump which depends locally on finitely many coordinates.
متن کاملBump Mapped Vector Fields
We present alternative ways of looking at vector elds that complement existing ow visualization methods. These techniques are based on bump mapping and are simple, easy to compute and fast to render. For example, in one of the techniques a surface from the vector eld is extracted and the directions of the vector values on the surface are normalized and used as surface normals. The shading of th...
متن کاملStacked SOI pixel detector using versatile fine pitch μ-bump technology
This Paper presents on 3D stacking technology with 2.5μm x 2.5μm In (Indium) bump connections with adhesive injection [1]. Instead of using the simple test device, this technology has been verified using the actual circuit level test chip. And it was found that the completion of stacking process is affected by the layout pattern of stacked each tier. In order to minimize those effects, we have ...
متن کاملOsmotic drug delivery using swellable-core technology.
Swellable-core technology (SCT) formulations that used osmotic pressure and polymer swelling to deliver drugs to the GI tract in a reliable and reproducible manner were studied. The SCT formulations consisted of a core tablet containing the drug and a water-swellable component, and one or more delivery ports. The in vitro and in vivo performance of two model drugs, tenidap and sildenafil, formu...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2009
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.12.565